NOVATEL’s engineering team, develop test programs for X-RAY 3D systems. The test software is developed starting from CAD data, by means of which it’s possible to automatically test all the solder joints.

The X-RAY 3D test system is mainly used to check electronic boards equipped by BGA, uBGAs and Flip Chip components. As a matter of fact, though, it’s possible to check solder joints on any type of SMT and PTH component as well as via- holes can. 3D-images are extracted by the X-Ray beam, making them similar to a “CT”: solder joints are “sliced” and each “slice” has a few micron thickness. By using X-Ray inspection, in conjunction with ICT, very high production yields can be achieved.

This solution represents a low cost, ideal, solution to test prototypes, and proves to be an indispensable solution for complex serial production boards.