1988 Novatel is established by the De Feo brothers. It is part of a six company panel named IPM GROUP. Novatel delivers contract manufacturing services for all the companies in the group.

1994 the gradual, incisive payphone market descent, suggests the establishment of a commercial department aimed at searching for electronics companies both on a regional and Nation-wide basis. To do so, the company feels the opportunity to enter the market with its own Quality Management System certified to the International standard UNI EN ISO 9000

1995 a new target is defined: to fully dominate the production technologies. This is accomplished by purchasing new assembly equipments and by further enhancing the organization qualification in its whole. To keep the pace with the holding company IPM (entering the Asian markets with its own payphone product lines), the conformal coating process is introduced by acquiring two Nordson automatic lines.

1999 the marketing campaign started in the preceding years, allows the acquisition of important customers active in the security field, Railway transportation systems and highly professional industrial electronics. New investments are then necessary for technology innovation and staff training. The commercial department grows, as well as the human resources. Production capability is enhanced by purchasing new SMT mounting equipments; traditional test systems are replaced by an AOI equipment (Orbotech) and by a first 3D X-Ray HP equipment

2005 The Lead-Free production process validation is started. Beside the traditional Tin-Lead wave soldering line a new Lead-Free Soltec line is installed. Qualifying training courses are held, for personnel directly involved in the new technology. A new SPEA 4040 ICT flying probe tester is acquired.

2006 the enhanced complexity of new generation products of customers acquired meanwhile, makes it necessary to augment the test equipments by acquiring a second HP 3D X-Ray machine. By purchasing a Unitek equipment, the Hot-Bar process is also introduced.

2008 the third HP X-Ray test line is aquired.

2009 the Flying probe SPEA 4040 ICT equipment is thoroughly updated, which makes it equivalent to the last generation machines.

2010 the innovation process doesn’t stop. A 100K components/hour last generation SMT line acquisition is in sight, along with a second Flying probe test system. A qualification process from Linear (a major company active in the VLSI components design and production) is under way for mounting and soldering of LGA type µBGA components, characterized by the absence of the typical soldering balls)